JPH0385162U - - Google Patents
Info
- Publication number
- JPH0385162U JPH0385162U JP2471890U JP2471890U JPH0385162U JP H0385162 U JPH0385162 U JP H0385162U JP 2471890 U JP2471890 U JP 2471890U JP 2471890 U JP2471890 U JP 2471890U JP H0385162 U JPH0385162 U JP H0385162U
- Authority
- JP
- Japan
- Prior art keywords
- solder tank
- pumping
- solder
- top surface
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 7
- 238000005086 pumping Methods 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2471890U JPH0385162U (en]) | 1989-09-01 | 1990-03-12 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10185289 | 1989-09-01 | ||
JP2471890U JPH0385162U (en]) | 1989-09-01 | 1990-03-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0385162U true JPH0385162U (en]) | 1991-08-28 |
Family
ID=31889916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2471890U Pending JPH0385162U (en]) | 1989-09-01 | 1990-03-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0385162U (en]) |
-
1990
- 1990-03-12 JP JP2471890U patent/JPH0385162U/ja active Pending